Core Architecture:
JESD-609 Code:
Min Operating Temperature:
Package / Case:
Peak Reflow Temperature (Cel):
Published:
Supply Voltage:
Supply Voltage-Max (Vsup):
Terminal Form:
Terminal Pitch:
Terminal Position:
Time@Peak Reflow Temperature-Max (s):
uPs/uCs/Peripheral ICs Type:
12 Records
Image Part Manufacturer Description Price Stock Action
R7S721010VCFP#AA0 Intersil (Renesas Electronics Corporation)
-
RFQ
72
In-stock Warehouse
ADD TO RFQ
XPC850ZT66B Motorola
-
RFQ
120
In-stock Warehouse
ADD TO RFQ
R7S721010VCBG#AC0 Intersil (Renesas Electronics Corporation)
-
RFQ
201
In-stock Warehouse
ADD TO RFQ
R7S721000VCBG#AC0 Intersil (Renesas Electronics Corporation)
-
RFQ
1,009
In-stock Warehouse
ADD TO RFQ
R7S721000VLFP#AA0 Intersil (Renesas Electronics Corporation)
-
RFQ
12,094
In-stock Warehouse
ADD TO RFQ
R7S721010VLFP#AA0 Intersil (Renesas Electronics Corporation)
-
RFQ
723
In-stock Warehouse
ADD TO RFQ
XPC850CVR50BU NXP Semiconductors
-
RFQ
33,685
In-stock Warehouse
ADD TO RFQ
XPC850DSLVR50BU NXP Semiconductors
-
RFQ
33,122
In-stock Warehouse
ADD TO RFQ
XPC850VR50BU NXP Semiconductors
-
RFQ
36,276
In-stock Warehouse
ADD TO RFQ
XPC850DEZT66BU NXP Semiconductors
-
RFQ
44,176
In-stock Warehouse
ADD TO RFQ
XPC850SRZT80BU NXP Semiconductors
-
RFQ
15,522
In-stock Warehouse
ADD TO RFQ
XPC850ZT50BU NXP Semiconductors
-
RFQ
2,821
In-stock Warehouse
ADD TO RFQ
RFQ
BOM